In high-tech manufacturing environments such as semiconductor fabs,display panel facilities,and advanced cleanrooms,airborne contamination is no longer limited to visible particles.While traditional particulate control methods like HEPA and ULPA filters are highly effective against dust and aerosols,they are not designed to address airborne molecular contamination(AMC).This invisible but highly reactive class of contaminants has become one of the most critical challenges in modern fabrication processes.AMC filtration is specifically engineered to remove these molecular-level pollutants from the air.Unlike particulate filters,amc filtration targets gaseous and vapor-phase contaminants that can penetrate deep into sensitive production areas and directly interact with wafers,photomasks,and process equipment.Understanding what contaminants AMC filtration can remove is essential for manufacturers seeking to protect yield,reliability,and long-term process stability.Airborne molecular contaminants are typically categorized by their chemical behavior rather than their size.One of the most common groups is acidic contaminants,such as hydrogen fluoride(HF),hydrogen chloride(HCl),sulfur dioxide(SO₂),and nitrogen oxides(NOx).These acidic gases often originate from chemical processes,wet benches,etching tools,and even outdoor industrial pollution that enters the cleanroom through make-up air systems.Without proper amc air filtration,acidic AMC can cause corrosion on metal layers,damage p

